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3D memory

See Hybrid Memory Cube.

Hybrid Memory Cube

A memory module technology from the Hybrid Memory Cube Consortium (HMCC), spearheaded by Micron and Samsung, that stacks chips vertically rather than horizontally. Finalized in 2013, Hybrid Memory Cubes (HMCs) provide 15 times the bandwidth of DDR3 chips while consuming 70% less power and 90% less space. Like DRAM, HMCs lose their content without power.

Initially used in supercomputers and high-speed servers, HMC memory is expected to migrate to all types of computing devices. See dynamic RAM, memory module and via.

3D Stacking
DRAM layers are stacked over a logic layer and connected with "vias" (corner cutout) that run through the silicon. This compact architecture is faster and more energy efficient than conventional DRAM modules. (Image courtesy of the HMC Consortium,

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