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MicroBGA

A CSP BGA chip package from Tessera Inc., San Jose, CA (www.tessera.com). The µBGA architecture uses very fine pitch between the solder balls that enable the packaging to be barely larger than the chip itself. Tessera's unique design uses elastomer layers to withstand changes in temperature between the printed circuit board and the chip (CTE). See CSP, BGA and CTE.




µBGA Packages
Tessera's µBGA packaging allows for very small chip footprints on the printed circuit board as is obvious from this picture. (Image courtesy of Tessera Inc.)






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