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A polymer-based, dielectric resin from Dow Chemical ( that is used to insulate the aluminum or copper wire traces on a chip. See ILD.


(Inter Layer Dielectric) The insulation used between layers of aluminum or copper wire that interconnect the transistors in a chip. There are three to four layers in a memory chip and five to seven in a logic chip with hundreds of meters of wiring. Polymer-based dielectrics, which emerged at the start of the 21st century, are expected to have a tremendous impact in chip design, as plastic insulating material dramatically reduces the crosstalk associated with glass-based dielectrics. See SiLK.

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