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lead frame

A common type of chip package that uses metal leads that extend outside the housing. Lead frame technology goes back to the early days of DIP chips, but is still widely used in many package varieties. See chip package.

Lead Frame Packages
These cross sections show the differences between lead frame chip packages in both standard and CSP varieties. (Illustration courtesy of Joseph Fjelstad.)

chip package

The housing that chips come in for plugging into (socket mount) or soldering onto (surface mount) the printed circuit board. Creating a mounting for a chip might seem trivial to the uninitiated, but chip packaging is a huge and complicated industry. The ability to provide more and more I/O interconnections to a die (bare chip) that is increasingly shrinking in size is an ever-present problem. In addition, the smaller size of the package contributes as much to the miniaturization of cellphones and other handheld devices as the shrinking of the semiconductor circuits. See BGA, CDIP, CERDIP, CERQUAD, CLCC, DIP, flatpack, package on package, PLCC, QFP, MCM, MCP, SOP, SOIC, SOJ, TSOP and ZIP.

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LDDSleaded chip carrier
LEleading edge
LE Bluetoothleading zeros
leadleadless chip carrier
lead acidleaf

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