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package on package

A chip package that contains two ball grid array (BGA) chips. A package on package (PoP) typically includes a RAM chip on top and a CPU chip on the bottom. See BGA and chip package.

A 3D Package
The top BGA package typically contains RAM, which can also be a multi-die module itself, while the bottom BGA holds the logic chip (the processor). The light green elements are the BGA substrates. The PCB is the printed circuit board.

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PA systemPackard Bell
PaaSPackard Bell NEC
PACpacked decimal
Pacificapacket analyzer
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packagepacket classification
package managerpacket conversion

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