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pad limited

A semiconductor chip that cannot be shrunk any further, because there would not be enough room for the bonding pads used for interconnection on the outer perimeter of the die. Although bonding pads are getting smaller, having shrunk below 50 microns, area array packaging has obviated the pad limited problem. See area array package.

area array package

A chip package in which any part of the surface area of the chip can be used for interconnection, rather than just the outer perimeter. See pad limited, flip chip, BGA and CSP.

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