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tape automated bonding

A process that places bare chips onto a printed circuit board (PCB) by first attaching them to a polyimide film. The film is moved to the target location, and the leads are cut and soldered to the board. Also called a "tape carrier package" (TCP), the bare chip is then encapsulated ("glob topped") with epoxy or plastic. See chip on board.

Tape Automated Bonding
After the chip leads are cut and soldered to the board, the chip is covered with a glob of epoxy or plastic. (Illustration courtesy of Joseph Fjelstad.)

chip on board

A bare chip that is mounted directly onto the printed circuit board (PCB). After the wires are attached, a glob of epoxy or plastic is used to cover the chip and its connections. The tape automated bonding (TAB) process is used to place the chip on the board. See tape automated bonding.

Chip On Board
The bare chip is adhered and wire bonded to the board, and an epoxy is poured over it to insulate and protect it. For illustrative purposes only, this picture shows a clear epoxy. (Image courtesy of Joseph Fjelstad.)

Side View
This side view shows how the wires connect the chip to the printed circuit board (PCB). (Image courtesy of Joseph Fjelstad.)

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