A CDE Definition
tape automated bonding
A process that places bare chips onto a printed circuit board (PCB) by first attaching them to a polyimide film. The film is moved to the target location, and the leads are cut and soldered to the board. Also called a "tape carrier package" (TCP), the bare chip is then encapsulated ("glob topped") with epoxy or plastic. See chip on board.
Tape Automated Bonding
chip on board
A bare chip that is mounted directly onto the printed circuit board (PCB). After the wires are attached, a glob of epoxy or plastic is used to cover the chip and its connections. The tape automated bonding (TAB) process is used to place the chip on the board. See tape automated bonding.
Chip On Board
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|Tango 2000||tape cartridge|
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